Our R&D centers are constantly developing innovative new solutions to optimize customers’ products and processes. And our experienced. responsive technical service teams ensure that customers around the globe receive support to help them create an exciting future of more sustainable molding compounds.

With Bakelite® EP 8111, Hexion Inc. (“Hexion” or the “Company”) is introducing a new high-tech epoxy molding compounds material for encapsulation. As an advantage, the new product does not contain any volatile substances such as formaldehyde or ammonium. Other advantages are its best mechanical and thermomechanical properties, high impact strength, media and crack resistance, good flow and fair curing times and a very good adhesion to brass and copper.

The new features in a nutshell:

  • Long flow electrical insulating material
  • Non-Formaldehyde containing material
  • High mechanical performance
  • High temperature stability
  • Crack resistant
  • Good adhesion to substrate (metal and PCBs)